Translational Informatics for Parkinson's Disease: from Big Biomedical Data to Small Actionable Alterations. - Bairong Shen; Yuxin Lin; Cheng Bi; Shengrong Zhou; Zhongchen Bai; Guangmin Zheng 002; Jing Zhou (Genom. Proteom. Bioinform., 2019)

Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias. - Rui Hu; Linhong Lu; Zhongchen Bai; Fashun Yang; Kui Ma; Zhao Ding (IEICE Electron. Express, 2024)

Novel accurate steady-state thermal resistance model for power chips embedded in TTSVs heat dissipation array. - Linhong Lu; Xinghua Fu; Rui Hu; Fashun Yang; Jiexin Lin; Zhongchen Bai; Kui Ma (Microelectron. J., 2024)