CPI Reliability Challenges of Large Flip Chip Packages and Effects of Kerf Size and Substrate. - Zhuo-Jie Wu; Manish Nayini; Charles Carey; Samantha Donovan; David Questad; Edmund D. Blackshear (IRPS, 2019)

A CMOS Compatible Monolithic Fiber Attach Solution with Reliable Performance and Self-Alignment. - Bo Peng; Tymon Barwicz; Asli Sahin; Thomas Houghton; Brittany Hedrick; Yusheng Bian; Michal Rakowski; Shuren Hu; Javier Ayala; Colleen Meagher; Zoey Sowinski; Karen Nummy; et al. (OFC, 2020)

Hybrid III-V laser integration on a monolithic silicon photonic platform. - Yusheng Bian; Koushik Ramachandran; Bo Peng; Brittany Hedrick; Scott Mills; Keith Donegan; Armand Rundquist; Ed Vail; Vaishnavi Karra; Firat Yasar; Monica Esopi; Benjamin Fasano; et al. (OFC, 2021)

Monolithic Silicon Photonics. - Ted Letavic; Massimo Sorbara; Ken Geiwont; Yusheng Bian; Vihbor Jain; Sameer Jain; Koushik Ramachandran; Zhuo-Jie Wu; Brittany Hedrick; Kevin K. Dezfulian; Yarong Lin; Teck Jung Tang; et al. (BCICTS, 2023)

Polarization mode dispersion in CMOS-integrated monolithic SiPh components: simulations and experiments. - Yusheng Bian; Hanyi Ding; Abdelsalam Aboketaf; Vaishnavi Karra; Massimo Sorbara; Takako Hirokawa; Salman Mosleh; Crystal Hedges; Won Suk Lee; Sujith Chandran; Avijit Chatterjee; Riddhi Nandi; et al. (OFC, 2023)

Monolithically integrated self-aligned SiN edge coupler with 520 mW high-power handling capability. - Yusheng Bian; Takako Hirokawa; Vaishnavi Karra; Arpan Dasgupta; Won Suk Lee; Abdelsalam Aboketaf; Francis Afzal; Ryan Sporer; Karen Nummy; Ken Giewont; Nickolas C. Harris; Reza Baghdadi; et al. (OFC, 2023)

Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal. - Zhuo-Jie Wu; Ping-Chuan Wang; Seungman Choi; Patrick Justison; Martin Gall; Jae Kyu Cho; Takako Hirokawa; Yusheng Bian; Thomas Houghton; Vaishnavi Karra; Dan Moy; Karen Nummy; et al. (OFC, 2023)