Frequency-Domain Modeling of Interconnects Based on Assemble Neural Network for 3-D Integration. - Zi-Xing Ye; Da-Wei Wang 003; Wen-Sheng Zhao; Xuan Lin; Nengyong Zhu; Min Tang; Jun Liu 027; Lingling Sun (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2026)