Numerical and experimental study of Microscale Laser Shock Processing using excimer laser. - Zhigang Che; Liangcai Xiong; Tielin Shi; Zirong Tang; Huayang Cheng; Likun Yang (NEMS, 2009)

Improved adhesion between C-MEMS and substrate by micromechanical interlocking. - Jie Gong; Zirong Tang; Tielin Shi; Guanglan Liao; Lei Nie; Shiyuan Liu (NEMS, 2009)

Low temperature direct bonding for hermetic wafer level packaging. - Lei Nie; Tielin Shi; Zirong Tang; Shiyuan Liu; Guanglan Liao (NEMS, 2009)

Scratch of submicron grooves on aluminum film with AFM diamond tip. - Ping Peng; Tielin Shi; Guanglan Liao; Zirong Tang; Chang Liu (NEMS, 2009)

Fabrication of biomimetic gecko setae by direct photolithography and micromolding processes. - Hao Lv; Shiyuan Liu; Peng Zhang; Zirong Tang (NEMS, 2011)

Defect detection of flip-chip solder joints using modal analysis. - Junchao Liu; Tielin Shi; Ke Wang; Zirong Tang; Guanglan Liao (Microelectron. Reliab., 2012)

Optimal design of periodic nanostructures formed in solar cells as an antireflective layer. - Yating Shi; Shiyuan Liu; Jinlong Zhu; Chuanwei Zhang; Xiuguo Chen; Zirong Tang (NEMS, 2013)

Metal-catalyst free integration of SiO2 nanowires into carbon MEMS. - Liangliang Xu; Tielin Shi; Shuang Xi; Hu Long; Shiyuan Liu; Zirong Tang (NEMS, 2013)

Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration. - Guanglan Liao; Pengfei Chen; Li Du; Lei Su 002; Zhiping Liu; Zirong Tang; Tielin Shi (Microelectron. Reliab., 2015)

X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm. - Junjie Shen 005; Pengfei Chen; Lei Su 002; Tielin Shi; Zirong Tang; Guanglan Liao (Microelectron. Reliab., 2016)

Microscopic Three-Dimensional Measurement Based on Telecentric Stereo and Speckle Projection Methods. - Kepeng Chen; Tielin Shi; Qiang Liu; Zirong Tang; Guanglan Liao (Sensors, 2018)

Implementation of extended kalman filter for localization of ambulance robot. - Chan-Yun Yang; Hooman Samani 001; Zirong Tang; Chunxu Li (Int. J. Intell. Robotics Appl., 2024)