Effects of lead widths and pitches on reliability of soldered joints and optimum simulation for QFP devices. - Songbai Xue; Yuxiu Wu; Zongjie Han; Ling Zhang (CGVR, 2006)

Hermetic Interlayer Interconnection Technology Based on SAC305 Solder Paste. - Yongfang Hu; Kun Yan; Ziyuan Wang; Liuwei Wang; Yipeng Sun; Yuefei Wang; Xinlong Zhang; Zongjie Han; Qingan Huang; Lei Han (CECNet, 2023)