Development of a Reliable High-Performance WLP for a SAW Device. - Zuohuan Chen; Daquan Yu (Sensors, 2022)

Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter. - Zuohuan Chen; Daquan Yu; Yi Zhong (Sensors, 2022)