Nanoscale Analysis of Breakdown Induced Crack Propagation in DTSCR Devices. - Xinqian Chen; Fei Hou; Zuoyuan Dong; Yuxin Zhang; Chaolun Wang; Fang Liang; Feibo Du; Zhiwei Liu; Xing Wu 005 (IRPS, 2022)

Microscopic Characterization of Failure Mechanisms in Long-Term Implanted Microwire Neural Electrodes. - Zijian Zhang; Q. Li; Zuoyuan Dong; Wanting Wang; S. T. Lai; Xin Yang; Fang Liang; Chaolun Wang; C. Luo; Liangjian Lyu; Z. Li; J. M. Xu; et al. (IRPS, 2023)

Catching the Missing EM Consequence in Soft Breakdown Reliability in Advanced FinFETs: Impacts of Self-heating, On-State TDDB, and Layout Dependence. - Zuoyuan Dong; Zixuan Sun; Xin Yang; Xiaomei Li; Yongkang Xue; Chen Luo; Puyang Cai; Zirui Wang; Shuying Wang; Yewei Zhang; Chaolun Wang; Pengpeng Ren; et al. (VLSI Technology and Circuits, 2023)

New Insights into TDDB in FinFET Based on Strain Analysis at the Atomistic Scale. - Zuoyuan Dong; Zixuan Sun; Lan Li; Zirui Wang; Changqing Ye; Yu Yao; Jialu Huang; Xiaomei Li; Xing Wu; Runsheng Wang (IRPS, 2025)