Andreas Tünnermann

Orcid: 0000-0003-4018-7626

According to our database1, Andreas Tünnermann authored at least 10 papers between 2008 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2024
Evaluation of Internal and External Starch Changes in Apples Using Hyper-Spectral Analyses in the NIR-SWIR.
Proceedings of the 14th Workshop on Hyperspectral Imaging and Signal Processing: Evolution in Remote Sensing, 2024

2023
Fabrication of Multicore Fibers for High Power Lasers, Sensing and Communications.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023

2022
Single Shot Phase Shift 3D Scanning with Convolutional Neural Network and Synthetic Fractals.
Proceedings of the 15th Eurographics Workshop on 3D Object Retrieval, 3DOR 2022, 2022

2019
Soldering and Packaging Study for an Optical Filter Required for High Resolution Earth Observation Space Missions.
Proceedings of the 7th International Conference on Photonics, Optics and Laser Technology, 2019

2018
Lithiumniobate Die Assembled by a Low-stress Soldering Technique - Method to Fasten a Surface Acoustic Wave Sensor.
Proceedings of the 6th International Conference on Photonics, Optics and Laser Technology, 2018

Ultra-large Mode Area Fibers for High Power Lasers.
Proceedings of the Optical Fiber Communications Conference and Exposition, 2018

2014
Enhancement of second harmonic generation in self-suspended lithium niobate photonic crystal cavities.
Proceedings of the 16th International Conference on Transparent Optical Networks, 2014

2012
Precisely Assembled Multi Deflection Arrays - Key Components for Multi Shaped Beam Lithography.
Proceedings of the Precision Assembly Technologies and Systems, 2012

2010
Alignment Procedures for Micro-optics.
Proceedings of the Precision Assembly Technologies and Systems, 2010

2008
Solder Bumping - A Flexible Joining Approach for the Precision Assembly of Optoelectronical Systems.
Proceedings of the Micro-Assembly Technologies and Applications, 2008


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