Chia-Yu Hsu

Orcid: 0000-0001-5488-8402

Affiliations:
  • Yuan Ze University, Department of Information Mangement, Chungli, Taiwan
  • National Tsing Hua University, Department of Industrial Engineering and Engineering Management, Hsinchu, Taiwan


According to our database1, Chia-Yu Hsu authored at least 14 papers between 2006 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
Guest editorial: Value chain collaboration for complicated product innovation and manufacturing excellence by industrial data-driven modeling and optimization.
Ind. Manag. Data Syst., 2024

Value co-creation in group enterprises: an evolutionary game theory-based analysis.
Int. J. Prod. Res., 2024

2021
Applications of new industrial engineering methodologies.
Comput. Ind. Eng., 2021

2018
Industry Applications of Computational Intelligence: Preface.
Int. J. Comput. Intell. Syst., 2018

Foreword: Smart manufacturing, innovative product and service design to empower Industry 4.0.
Comput. Ind. Eng., 2018

2016
Semiconductor manufacturing intelligence and automation.
Comput. Ind. Eng., 2016

2015
A novel approach to hedge and compensate the critical dimension variation of the developed-and-etched circuit patterns for yield enhancement in semiconductor manufacturing.
Comput. Oper. Res., 2015

2014
Overlay Error Compensation Using Advanced Process Control With Dynamically Adjusted Proportional-Integral R2R Controller.
IEEE Trans Autom. Sci. Eng., 2014

Manufacturing intelligence and innovation for digital manufacturing and operational excellence.
J. Intell. Manuf., 2014

2013
Overall Wafer Effectiveness (OWE): A novel industry standard for semiconductor ecosystem as a whole.
Comput. Ind. Eng., 2013

2012
Manufacturing intelligence to forecast and reduce semiconductor cycle time.
J. Intell. Manuf., 2012

2011
UNISON analysis to model and reduce step-and-scan overlay errors for semiconductor manufacturing.
J. Intell. Manuf., 2011

Manufacturing intelligence for determining machine subgroups to enhance yield in semiconductor manufacturning.
Proceedings of the Winter Simulation Conference 2011, 2011

2006
A novel method for determining machine subgroups and backups with an empirical study for semiconductor manufacturing.
J. Intell. Manuf., 2006


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