Dan Maeda

According to our database, Dan Maeda authored at least 1 paper in 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

Thermal Analysis of Reflow Process for PIC-Embedded Package Substrate with 2.3D RDL Interposer for Co-Packaged Optics.

Akihiro Noriki, Hirotaka Uemura, Haruhiko Kuwatsuka, Naoki Matsui, Reona Motoji, Dan Maeda, Tomoya Sugita, Fumi Nakamura, Takeru Amano

Proceedings of the International 3D Systems Integration Conference, 2024