Dipayan Das

Orcid: 0000-0002-7681-1868

Affiliations:
  • Florida Atlantic University, Department of Mathematical Sciences, Boca Raton, FL, USA
  • NTT Corporation, Tokyo, Japan (former)
  • CISPA Helmholtz Center for Information Security, Saarbrücken, Germany (former)
  • National Institute of Technology, Department of Mathematics, Durgapur, India (former)


According to our database1, Dipayan Das authored at least 12 papers between 2018 and 2025.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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Links

Online presence:

On csauthors.net:

Bibliography

2025
Privacy-Preserving Multi-signatures: Generic Techniques and Constructions Without Pairings.
Proceedings of the Public-Key Cryptography - PKC 2025, 2025

2024
Key Recovery Attack on the Partial Vandermonde Knapsack Problem.
Proceedings of the Advances in Cryptology - EUROCRYPT 2024, 2024

2023
On the Hardness of the Finite Field Isomorphism Problem.
Proceedings of the Advances in Cryptology - EUROCRYPT 2023, 2023

2022
Fiat-Shamir signatures without aborts using Ring-and-Noise assumptions.
IACR Cryptol. ePrint Arch., 2022

2020
Lattice signatures using NTRU on the hardness of worst-case ideal lattice problems.
IET Inf. Secur., 2020

Fiat-Shamir with Aborts: From Identification Schemes to Linkable Ring Signatures.
Proceedings of the Security, Privacy, and Applied Cryptography Engineering, 2020

MPSign: A Signature from Small-Secret Middle-Product Learning with Errors.
Proceedings of the Public-Key Cryptography - PKC 2020, 2020

2019
Modular lattice signatures, revisited.
IACR Cryptol. ePrint Arch., 2019

Middle-Product Learning with Rounding Problem and Its Applications.
Proceedings of the Advances in Cryptology - ASIACRYPT 2019, 2019

Ring Signatures Based on Middle-Product Learning with Errors Problems.
Proceedings of the Progress in Cryptology - AFRICACRYPT 2019, 2019

2018
A Novel Lattice Reduction Algorithm.
Proceedings of the 15th International Joint Conference on e-Business and Telecommunications, 2018

Compact Lattice Signatures.
Proceedings of the 15th International Joint Conference on e-Business and Telecommunications, 2018


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