Fulong Zhu

According to our database, Fulong Zhu authored at least 2 papers between 2018 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

In Situ Warpage Measurement of Electronic Packages With Projected Speckle DIC and Deep Learning-Based ROI Identification.

Yuhan Gao, Chuanguo Xiong, Weishan Lv, Kezhong Xu, Xin Lei, Fulong Zhu

IEEE Trans. Instrum. Meas., 2024

2018

Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique.

Fulong Zhu, Xinxin Lin, Wei Zhang, Jiajie Fan, Sheng Liu

IEEE Access, 2018