Huai-En Lin

According to our database, Huai-En Lin authored at least 1 paper in 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

Thermo-Mechanical Stress and Its Effect on the Fabrication and Reliability of Cu-SiO2 Hybrid Bonds for 3D IC Heterogeneous Integration (Invited).

Chih Chen, Shih-Chi Yang, You-Yi Lin, Huai-En Lin, Dinh-Phuc Tran

Proceedings of the IEEE International Reliability Physics Symposium, 2025