Jaechoon Kim

According to our database, Jaechoon Kim authored at least 2 papers between 2022 and 2025.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2025

Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model.

Jeong-Hyeon Park, Jaechoon Kim, Sukwon Jang, Sungho Mun, Eun-Ho Lee

IEEE Access, 2025

2022

Application of Convolutional Neural Network to Predict Anisotropic Effective Thermal Conductivity of Semiconductor Package.

Tae-Hyun Kim, Jeong-Hyeon Park, Ki Wook Jung, Jaechoon Kim, Eun-Ho Lee

IEEE Access, 2022