Jeong-Hyeon Park
Orcid: 0000-0001-5305-3710
According to our database1,
Jeong-Hyeon Park
authored at least 4 papers
between 2003 and 2025.
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Bibliography
2025
Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model.
IEEE Access, 2025
2022
Application of Convolutional Neural Network to Predict Anisotropic Effective Thermal Conductivity of Semiconductor Package.
IEEE Access, 2022
2004
Int. J. Comput. Integr. Manuf., 2004
2003
Simul., 2003