Seung-Han Chung

According to our database, Seung-Han Chung authored at least 1 paper in 2025.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2025

Fabrication of through glass via (TGV) substrates using a pulse width modulated (PWM) vacuum suction system for molten solder filling.

Seung-Han Chung, Jin-Yeong Park, Yong-Kweon Kim, Seung-Ki Lee, Jae-Hyoung Park

IEICE Electron. Express, 2025