Seungjun Oh

Orcid: 0009-0000-7989-6361

According to our database1, Seungjun Oh authored at least 13 papers between 2021 and 2025.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2025
Graph-Assisted Stitching for Offline Hierarchical Reinforcement Learning.
CoRR, June, 2025

Hybrid 3D-4D Gaussian Splatting for Fast Dynamic Scene Representation.
CoRR, May, 2025

Self-supervised risk factor model using dual Recurrent State Space Models.
Knowl. Based Syst., 2025

Performance of Joint Channel Estimation and Spreading Sequence Detection for DSSS Systems.
Proceedings of the International Conference on Artificial Intelligence in Information and Communication, 2025

Generative Densification: Learning to Densify Gaussians for High-Fidelity Generalizable 3D Reconstruction.
Proceedings of the IEEE/CVF Conference on Computer Vision and Pattern Recognition, 2025

CodecNeRF: Toward Fast Encoding and Decoding, Compact, and High-quality Novel-view Synthesis.
Proceedings of the AAAI-25, Sponsored by the Association for the Advancement of Artificial Intelligence, February 25, 2025

2024
Toward Human-Scale Magnetic Particle Imaging: Development of the First System With Superconductor- Based Selection Coils.
IEEE Trans. Medical Imaging, December, 2024

Better Think with Tables: Leveraging Tables to Enhance Large Language Model Comprehension.
CoRR, 2024

Novel Algorithm for Joint Channel Estimation and Spreading Sequence Detection in DSSS Systems.
IEEE Access, 2024

Novelty-aware Graph Traversal and Expansion for Hierarchical Reinforcement Learning.
Proceedings of the 33rd ACM International Conference on Information and Knowledge Management, 2024

Parameter-Efficient Instance-Adaptive Neural Video Compression.
Proceedings of the Computer Vision - ACCV 2024, 2024

2023
Aggregation Volume Estimator-Based Offline Programming Guidance of Magnetic Nanoparticles in the Realistic Rat-Brain Vasculature Model.
Adv. Intell. Syst., September, 2023

2021
Development of Eddy Current Sensor for Measuring Thickness of Copper Wafer in sub-Micron Scale.
Proceedings of the IEEE International Workshop on Metrology for Industry 4.0 & IoT, 2021


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