Takahide Murayama

According to our database, Takahide Murayama authored at least 2 papers between 2011 and 2015.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2015

TSV etching and VDP process integration for high reliability.

Takahide Murayama, Yasuhiro Morikawa

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2011

TSV process solution for 3D-IC.

Satoru Toyoda, A. Shibata, M. Harada, Takahide Murayama, Toshiyuki Sakuishi, M. Hatanaka, Yasuhiro Morikawa, Koukou Suu

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011