Wataru Doi

According to our database, Wataru Doi authored at least 1 paper in 2024.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2024

Face-Down and Heterogeneous Chip Bonding Technology on Waffle-Wafer for Bumpless Chip-an-Wafer (COW) Package.

Yoshiaki Satake, Tatsuya Funaki, Wataru Doi, Hajime Kato, Shogo Okita, Takayuki Ohba

Proceedings of the International 3D Systems Integration Conference, 2024