Wei Guo

Orcid: 0000-0003-1215-7876

According to our database1, Wei Guo authored at least 15 papers between 2021 and 2026.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2026
Structure anchor graph learning for multi-view clustering.
Pattern Recognit., 2026

2025
Transductive Parameter-Free Propagation Framework for Few-Shot Distribution Rectification.
IEEE Trans. Neural Networks Learn. Syst., August, 2025

BFCP: Pursue Better Forward Compatibility Pretraining for Few-Shot Class-Incremental Learning.
IEEE Trans. Neural Networks Learn. Syst., August, 2025

2024
Discriminative sparse subspace learning with manifold regularization.
Expert Syst. Appl., 2024

2023
Robust semi-supervised multi-view graph learning with sharable and individual structure.
Pattern Recognit., August, 2023

Flexible few-shot class-incremental learning with prototype container.
Neural Comput. Appl., May, 2023

Multi-view dimensionality reduction learning with hierarchical sparse feature selection.
Appl. Intell., May, 2023

Multi-feature space similarity supplement for few-shot class incremental learning.
Knowl. Based Syst., April, 2023

Scalable one-stage multi-view subspace clustering with dictionary learning.
Knowl. Based Syst., 2023

Robust Structured Sparse Subspace Clustering with Neighborhood Preserving Projection.
Proceedings of the IEEE International Conference on Multimedia and Expo, 2023

2022
Geometric imbalanced deep learning with feature scaling and boundary sample mining.
Pattern Recognit., 2022

Semi-supervised multiple empirical kernel learning with pseudo empirical loss and similarity regularization.
Int. J. Intell. Syst., 2022

Pseudolabel-guided multiview consensus graph learning for semisupervised classification.
Int. J. Intell. Syst., 2022

Better Embedding and More Shots for Few-shot Learning.
Proceedings of the Thirty-First International Joint Conference on Artificial Intelligence, 2022

2021
Multi-kernel Support Vector Data Description with boundary information.
Eng. Appl. Artif. Intell., 2021


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