Yang Feng
Orcid: 0000-0002-9917-2878Affiliations:
- Donghua University, School of Information Science and Technology, Shanghai, China
  According to our database1,
  Yang Feng
  authored at least 6 papers
  between 2019 and 2025.
  
  
Collaborative distances:
Collaborative distances:
Timeline
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Online presence:
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    on orcid.org
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Bibliography
  2025
    Swarm Evol. Comput., 2025
    
  
  2023
Methods of Solving Passband Ripples and Sidelobes for Wavelet Transform Processor Using Surface Acoustic Wave Device.
    
  
    IEEE Trans. Ind. Electron., 2023
    
  
Enhanced Frequency Stability of SAW Yarn Tension Sensor by Using the Dual Differential Channel Surface Acoustic Wave Oscillator.
    
  
    Sensors, 2023
    
  
  2022
    IEEE Trans. Ind. Electron., 2022
    
  
Methods of solving in-band ripples and out-of-band suppression for yarn tension sensor based on surface acoustic wave.
    
  
    IET Circuits Devices Syst., 2022
    
  
  2019
Study of the Doubly Clamped Beam Yarn Tension Sensor Based on the Surface Acoustic Wave.
    
  
    IEEE Trans. Ind. Electron., 2019