Zhenxiang Yi

According to our database, Zhenxiang Yi authored at least 17 papers between 2015 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

A Millimeter-Wave Shared-Volume Dual-Aperture Antenna Array With Enhanced Spatial Coverage Efficiency for IoT Devices.

Weiguang Song, Grant Gourley, Kun Zhao, Jin Zhang, George Goussetis, Zhenxiang Yi, Lei Wang

IEEE Internet Things J., July, 2025

Package-Tolerant MEMS Thermal Wind Sensors Using SIG Technology.

Bo Qi, Wenxuan Chen, Zhenxiang Yi, Ming Qin, Qing-An Huang, Lili Gao

IEEE Trans. Instrum. Meas., 2025

2024

Novel Temperature Drift Compensation for MEMS Thermal Wind Sensors by Heating Power Calibration Circuits.

Bo Qi, Zhenxiang Yi, Ming Qin, Qing-An Huang

IEEE Trans. Instrum. Meas., 2024

Sensitivity-Enhanced Non-Invasive Glucose Sensor Using Interdigital Capacitors.

Shasha Yang, Shiwen Gao, Yi Zhuang, Lili Gao, Zhenxiang Yi

Proceedings of the 2024 IEEE SENSORS, Kobe, Japan, October 20-23, 2024, 2024

2023

Linearity and Sensitivity Analysis of MEMS Thermal Wind Sensor via Analytical Model.

Zhenjun Wang, Zhenxiang Yi, Ming Qin, Qing-An Huang, Zai-Fa Zhou

IEEE Trans. Instrum. Meas., 2023

Research on Dust Effect for MEMS Thermal Wind Sensors.

Zhenxiang Yi, Yishan Wang, Ming Qin, Qing-An Huang

Sensors, 2023

2022

Analysis and Compensation of Benchmark Drift of Micromachined Thermal Wind Sensor Caused by Packaging Asymmetry.

Zhenjun Wang, Zhenxiang Yi, Run Tian, Ming Qin, Qing-An Huang, Zai-Fa Zhou, Kevin Long

IEEE Trans. Ind. Electron., 2022

2021

Low-Drift MEMS Thermal Wind Sensor With Symmetric Packaging Using Plastic Injection Molding Process.

Zhenjun Wang, Zhenxiang Yi, Ming Qin, Qing-An Huang

IEEE Trans. Instrum. Meas., 2021

2.5D Flexible Wind Sensor Using Differential Plate Capacitors.

Yu Wan, Zhenxiang Yi

Sensors, 2021

2019

A Fast Response Flexible Humidity Sensor based on PTFE Micropore Substrate.

Wenhao Chen, Zhenyu Wei, Jianqiu Huang, Zhenxiang Yi, Qing-An Huang

Proceedings of the 2019 IEEE SENSORS, Montreal, QC, Canada, October 27-30, 2019, 2019

2018

Annular-Encapsulation Packaging to Realize High-Performance MEMS Thermal Wind Sensor.

Yizhou Ye, Zhenjun Wang, Zhenxiang Yi, Ming Qin, Qing-An Huang

Proceedings of the 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2018

Sensitivity Analysis of Micromachined Thermal Wind Sensor Based on Back Surface Sensing Mode.

Zhenjun Wang, Zhenxiang Yi, Yizhou Ye, Ming Qin, Qing-An Huang

Proceedings of the 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2018

Experimental Study of a Dual-Mode Control MEMS Wind Sensor with High Accuracy.

Shang Wang, Jinquan Wang, Zhenxiang Yi, Ming Qin, Qing-An Huang

Proceedings of the 2018 IEEE SENSORS, New Delhi, India, October 28-31, 2018, 2018

2017

Investigation of housing on packaged MEMS wind sensors for industrial application.

Zhenxiang Yi, Lifeng Wang, Zhen Zhu, Qing-An Huang

Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017

2016

A 3D Model of the Thermoelectric Microwave Power Sensor by MEMS Technology.

Zhenxiang Yi, Xiaoping Liao

Sensors, 2016

High-power handling capacity and output response of a capacitive microwave power sensor.

Hao Yan, Xiaoping Liao, Zhenxiang Yi

Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016

2015

Temperature Effects on the Wind Direction Measurement of 2D Solid Thermal Wind Sensors.

Bei Chen, Yanqing Zhu, Zhenxiang Yi, Ming Qin, Qing-An Huang

Sensors, 2015