Ah-Young Park

According to our database, Ah-Young Park authored at least 2 papers in 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2016

Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface.

Ah-Young Park, Satish C. Chaparala, Seungbae Park

Microelectron. Reliab., 2016

Prediction of deformation during manufacturing processes of silicon interposer package with TSVs.

Yeonsung Kim, Ah-Young Park, Chin-Li Kao, Michael Su, Bryan Black, Seungbae Park

Microelectron. Reliab., 2016