Anmin Hu

According to our database1, Anmin Hu authored at least 8 papers between 1998 and 2014.

Collaborative distances:

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2014
Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W substrates.
Microelectronics Reliability, 2014

2013
Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps.
Microelectronics Reliability, 2013

Study on low-Ag content Sn-Ag-Zn/Cu solder joints.
Microelectronics Reliability, 2013

2012
Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation.
Microelectronics Reliability, 2012

Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder.
Microelectronics Reliability, 2012

2011
Effect of Ag on oxidation of Cu-base leadframe.
Microelectronics Reliability, 2011

Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates.
Microelectronics Reliability, 2011

1998
Effect of Sway on Image Fidelity in Whole-body Digitizing.
Proceedings of the Conference on Three-Dimensional Image Capture and Applications, 1998


  Loading...