Bo Seok Shim

According to our database, Bo Seok Shim authored at least 3 papers between 2021 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Improving Estimation of Layer Thickness and Identification of Slicer for 3D Printing Forensics.

Bo Seok Shim, Jong-Uk Hou

Sensors, October, 2023

Source Identification of 3D Printer Based on Layered Texture Encoders.

Bo Seok Shim, Jae Hong Choe, Jong-Uk Hou

IEEE Trans. Multim., 2023

2021

SI3DP: Source Identification Challenges and Benchmark for Consumer-Level 3D Printer Forensics.

Bo Seok Shim, Yoo Seung Shin, Seong-Wook Park, Jong-Uk Hou

Proceedings of the MM '21: ACM Multimedia Conference, Virtual Event, China, October 20, 2021