Bo-Yi Tsai
According to our database1,
Bo-Yi Tsai
authored at least 3 papers
between 2018 and 2025.
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Bibliography
2025
Thermal Model Extraction at Chip Boundaries for Thermal Simulation of Chip in a System.
Proceedings of the 26th International Symposium on Quality Electronic Design, 2025
Proceedings of the 26th International Symposium on Quality Electronic Design, 2025
2018
KSII Trans. Internet Inf. Syst., 2018