Boguslaw Wiecek

Orcid: 0000-0002-5003-1687

According to our database1, Boguslaw Wiecek authored at least 15 papers between 2006 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2024
Modelling and Thermographic Measurements of LED Optical Power.
Sensors, March, 2024

2023
Obstacle Detection in Infrared Navigation for Blind People and Mobile Robots.
Sensors, August, 2023

2021
Second-Harmonic Contactless Method for Measurement of RMS Current Using a Standard Infrared Camera.
IEEE Trans. Instrum. Meas., 2021

2020
Multilayer thermal object identification in frequency domain using IR thermography and vector fitting.
Int. J. Circuit Theory Appl., 2020

The Application of NIR Spectrometer for Average Temperature Measurement in Optical Fibers Based on Spontaneous Raman Scattering for DTS Applications.
Proceedings of the 27th International Conference on Mixed Design of Integrated Circuits and System, 2020

Thermal Characterization of Electronic Components Using Single-detector IR Measurement and 3D Heat Transfer Modelling.
Proceedings of the 27th International Conference on Mixed Design of Integrated Circuits and System, 2020

2019
Dynamic thermal heat pipes analysis: Thermal impedance in start-up condition.
Microelectron. J., 2019

2017
Thermal impedance measurement of integrated inductors on bulk silicon substrate.
Microelectron. Reliab., 2017

Oscillatory behaviour of transient thermal problems in microelectronics.
Proceedings of the 24th International Conference Mixed Design of Integrated Circuits and Systems, 2017

2016
Macroscale heat transfer in human tissues.
Proceedings of the 2016 MIXDES, 2016

2015
Modelling and IR measurement of the electronic substrate thermal conductivity.
Microelectron. Reliab., 2015

High-bitrate downhole telemetry system.
Proceedings of the IEEE International Symposium on Power Line Communications and Its Applications, 2015

2011
Application of genetic algorithms for electronic devices placement in structures with heat conduction through the substrate.
Microelectron. Reliab., 2011

2009
Optimal placement of electronic devices in forced convective cooling conditions.
Microelectron. Reliab., 2009

2006
Measurements and simulations of transient characteristics of heat pipes.
Microelectron. Reliab., 2006


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