Byung-Seon Kong

According to our database1, Byung-Seon Kong
  • authored at least 1 paper in 2006.
  • has a "Dijkstra number"2 of six.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2006
The effect of hygro-mechanical and thermo-mechanical stress on delamination of gold bump.
Microelectronics Reliability, 2006


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