Byung-seung Yim

According to our database, Byung-seung Yim authored at least 7 papers between 2011 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs).

Byung-seung Yim, Young-Eui Shin, Jong-Min Kim

Microelectron. Reliab., 2018

2016

Thermo-mechanical reliability of a multi-walled carbon nanotube-incorporated solderable isotropic conductive adhesive.

Byung-seung Yim, Jong-Min Kim

Microelectron. Reliab., 2016

2014

An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler.

Byung-seung Yim, Jeong-Il Lee, Byung-Hun Lee, Young-Eui Shin, Jong-Min Kim

Microelectron. Reliab., 2014

2012

Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging.

Byung-seung Yim, Yumi Kwon, Seung Hoon Oh, Jooheon Kim, Yong-Eui Shin, Seong Hyuk Lee, Jongmin Kim

Microelectron. Reliab., 2012

The effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives (ACAs).

Jiwon Kim, Byung-seung Yim, Jongmin Kim, Jooheon Kim

Microelectron. Reliab., 2012

2011

Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-terminated siloxane oligomer with or without reductant.

Yumi Kwon, Byung-seung Yim, Jongmin Kim, Jooheon Kim

Microelectron. Reliab., 2011

Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs).

Yumi Kwon, Byung-seung Yim, Jongmin Kim, Jooheon Kim

Microelectron. Reliab., 2011