D. S. Yang

According to our database, D. S. Yang authored at least 1 paper in 2011.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2011

Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound.

Yanhong Tian, Chunjin Hang, Chunqing Wang, G. Q. Ouyang, D. S. Yang, J. P. Zhao

Microelectron. Reliab., 2011