Dalia Nandi Das

According to our database1, Dalia Nandi Das authored at least 2 papers in 2020.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2020
Heat Mitigation in 3D ICs by Improvised TTSV Structure.
Proceedings of the 3rd International Symposium on Devices, Circuits and Systems, 2020

Modeling and Analysis of 3D IC Structures for Heat Mitigation by Thermal Through Silicon Vias.
Proceedings of the 15th IEEE International Conference on Industrial and Information Systems, 2020


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