Fei Wang

Orcid: 0000-0001-6567-0265

Affiliations:
  • Shanghai University, School of Mechatronic Engineering and Automation, Shanghai Key Lab of Power Station Automation Technology, China
  • Eindhoven University of Technology, The Netherlands (PhD 2010)


According to our database1, Fei Wang authored at least 11 papers between 2017 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2023
Hierarchical Game for Low-Carbon Energy and Transportation Systems Under Dynamic Hydrogen Pricing.
IEEE Trans. Ind. Informatics, 2023

Multicharacteristics Arc Model and Autocorrelation-Algorithm Based Arc Fault Detector for DC Microgrid.
IEEE Trans. Ind. Electron., 2023

Monitoring IGBT Module Bond Wire Fatigue Use Turn-Off Time.
Proceedings of the 49th Annual Conference of the IEEE Industrial Electronics Society, 2023

2021
A ZVZCS Hybrid Dual Full-Bridge Converter Suitable for Wide Input Voltage Range.
IEEE Trans. Ind. Electron., 2021

A Novel Bridgeless Cuk PFC Converter With Further Reduced Conduction Losses and Simple Circuit Structure.
IEEE Trans. Ind. Electron., 2021

2020
Synthesis of Integrated Multiport DC-DC Converters With Reduced Switches.
IEEE Trans. Ind. Electron., 2020

2019
A Minimum Loss Routing Algorithm Based on Real-Time Transaction in Energy Internet.
IEEE Trans. Ind. Informatics, 2019

Modeling and Comparisons of Aggregated Flyback Microinverters in Aspect of Harmonic Resonances With the Grid.
IEEE Trans. Ind. Electron., 2019

2017
Flyback-Based Three-Port Topologies for Electrolytic Capacitor-Less LED Drivers.
IEEE Trans. Ind. Electron., 2017

Perturbation influences of parameters on dynamic performance of a virtual synchronous generator.
Proceedings of the IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society, Beijing, China, October 29, 2017

Control strategy ensuring multi-mode seamless transition for a single-phase LCL inverter.
Proceedings of the IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society, Beijing, China, October 29, 2017


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