Fei-Yi Hung

According to our database, Fei-Yi Hung authored at least 8 papers between 2011 and 2015.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of four.

2015

Effect of annealing on the microstructure and bonding interface properties of Ag-2Pd alloy wire.

Yi-Wei Tseng, Fei-Yi Hung, Truan-Sheng Lui, Mei-Yu Chen, Hao-Wen Hsueh

Microelectron. Reliab., 2015

Microstructure, tensile and electrical properties of gold-coated silver bonding wire.

Yi-Wei Tseng, Fei-Yi Hung, Truan-Sheng Lui

Microelectron. Reliab., 2015

2014

Microstructure, electric flame-off (EFO) characteristics and tensile properties of silver-lanthanum alloy wire.

Hao-Wen Hsueh, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen, Jun-Kai Chang

Microelectron. Reliab., 2014

2013

Simple Fabrication Process for 2D ZnO Nanowalls and Their Potential Application as a Methane Sensor.

Tse-Pu Chen, Sheng-Po Chang, Fei-Yi Hung, Shoou-Jinn Chang, Zhan-Shuo Hu, Kuan-Jen Chen

Sensors, 2013

Effect of the direct current on microstructure, tensile property and bonding strength of pure silver wires.

Hao-Wen Hsueh, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen

Microelectron. Reliab., 2013

2011

An investigation into the crystallization and electric flame-off characteristics of 20 μm copper wires.

Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen, Hao-Wen Hsueh

Microelectron. Reliab., 2011

A study on the tensile fracture mechanism of 15 μm copper wire after EFO process.

I-Ting Huang, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen, Hao-Wen Hsueh

Microelectron. Reliab., 2011

Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires.

Hao-Wen Hsueh, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen

Microelectron. Reliab., 2011