Feifan Luo

According to our database, Feifan Luo authored at least 9 papers between 2021 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Deep Frequency Awareness Functional Maps for Robust Shape Matching.

Feifan Luo, Qinsong Li, Ling Hu, Haibo Wang, Haojun Xu, Xinru Liu, Shengjun Liu, Hongyang Chen

IEEE Trans. Vis. Comput. Graph., October, 2025

Spectral Descriptors for 3D Deformable Shape Matching: A Comparative Survey.

Shengjun Liu, Haibo Wang, Dong-Ming Yan, Qinsong Li, Feifan Luo, Zi Teng, Xinru Liu

IEEE Trans. Vis. Comput. Graph., March, 2025

2024

Deformable shape matching with multiple complex spectral filter operator preservation.

Qinsong Li, Yueyu Guo, Xinru Liu, Ling Hu, Feifan Luo, Shengjun Liu

Vis. Comput., July, 2024

AWEDD: a descriptor simultaneously encoding multiscale extrinsic and intrinsic shape features.

Shengjun Liu, Feifan Luo, Qinsong Li, Xinru Liu, Ling Hu

Vis. Comput., April, 2024

Deep MSFOP: Multiple Spectral filter Operators Preservation in Deep Functional Maps for Unsupervised Shape Matching.

Feifan Luo, Qingsong Li, Ling Hu, Xinru Liu, Haojun Xu, Haibo Wang, Ting Li, Shengjun Liu

CoRR, 2024

Concrete but Less Helpful? Understanding the Impact of Content Concreteness and Two-sidedness on Review Helpfulness.

Xixian Peng, Jiaqi Ren, Feifan Luo, Yutong Guo

Proceedings of the 45th International Conference on Information Systems, 2024

2022

Maximum Throughput in the Unlicensed Band under 3GPP Fairness.

Jianbin Xiao, Haowei Xu, Xinghua Sun, Feifan Luo, Wen Zhan

Proceedings of the IEEE/CIC International Conference on Communications in China, 2022

Optimal Coexistence of NR-U with Wi-Fi under 3GPP Fairness Constraint.

Feifan Luo, Xinghua Sun, Yayu Gao, Wen Zhan, Peng Liu, Ziyang Guo

Proceedings of the IEEE International Conference on Communications, 2022

2021

Distributed Delay Optimization of Machine-Type Communications in 5G Networks.

Feifan Luo, Xinghua Sun, Wen Zhan, Jun Zou, Hongzhou Tan

Proceedings of the Computing, Communications and IoT Applications, ComComAp 2021, Shenzhen, 2021