Fengqun Wang
Orcid: 0000-0003-2465-7982
According to our database1,
Fengqun Wang authored at least 14 papers
between 2021 and 2026.
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Bibliography
2026
Forward Secure Data Sharing Based on Proxy Re-Encryption in Industrial Internet of Things.
IEEE Trans. Netw. Serv. Manag., 2026
MPDA-HPR: Multi-Dimensional Privacy-Preserving Data Aggregation Based on Homomorphic Proxy Re-Encryption for Industrial Internet of Things.
IEEE Trans. Dependable Secur. Comput., 2026
Towards Privacy-Preserving Unmanned Aerial Vehicles Shared Logistics via Dynamic Sanitizable Signature with Multiple Sanitizers.
IACR Cryptol. ePrint Arch., 2026
A large-language-model-guided progressive error-correction framework for structured process modeling.
Expert Syst. Appl., 2026
2025
Conditional Privacy-Preserving Transaction for the Unspent Transaction Output-Based Multi-Chain Blockchain System.
IEEE Trans. Computers, July, 2025
Blockchain-Based Privacy-Preserving Deduplication and Integrity Auditing in Cloud Storage.
IEEE Trans. Computers, May, 2025
Blockchain-Assisted Flexible Revocable Anonymous Authentication in Industrial Internet of Things.
IEEE Trans. Netw. Sci. Eng., 2025
A Secure Anonymous Authentication and Key Agreement Scheme for UAV Swarms in Emergency Rescue Environments.
Proceedings of the 31th IEEE International Conference on Parallel and Distributed Systems, 2025
2024
Lightweight and Secure Data Sharing Based on Proxy Re-Encryption for Blockchain-Enabled Industrial Internet of Things.
IEEE Internet Things J., April, 2024
Blockchain-Based Secure Cross-Domain Data Sharing for Edge-Assisted Industrial Internet of Things.
IEEE Trans. Inf. Forensics Secur., 2024
Blockchain-Based Lightweight Message Authentication for Edge-Assisted Cross-Domain Industrial Internet of Things.
IEEE Trans. Dependable Secur. Comput., 2024
Verifiable Data Sharing Based on Autonomous Path Proxy Re-Encryption for Industrial Internet of Things.
Proceedings of the 20th International Conference on Mobility, Sensing and Networking, 2024
2023
IEEE Trans. Netw. Serv. Manag., March, 2023
2021
IEEE Trans. Ind. Electron., 2021