Gian Piero Deidda

According to our database, Gian Piero Deidda authored at least 8 papers between 2018 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Forward Electromagnetic Induction Modelling in a Multilayered Half-Space: An Open-Source Software Tool.

Gian Piero Deidda, Patricia Diaz de Alba, Federica Pes, Giuseppe Rodriguez

Remote. Sens., April, 2023

2022

Application of Resistivity and Seismic Refraction Tomography for Landslide Stability Assessment in Vallcebre, Spanish Pyrenees.

Mahjoub Himi, Mickel Anton, Alex Sendrós, Clàudia Abancó, Maurizio Ercoli, Raúl Lovera, Gian Piero Deidda, Aritz Urruela, Lluís Rivero, Albert Casas

Remote. Sens., December, 2022

Geophysical Study of the Diendorf-Boskovice Fault System (Austria).

Valeria Paoletti, Esther Hintersberger, Ingrid Schattauer, Maurizio Milano, Gian Piero Deidda, Robert Supper

Remote. Sens., 2022

Frequency-Domain Electromagnetic Mapping of an Abandoned Waste Disposal Site: A Case in Sardinia (Italy).

Gian Piero Deidda, Mahjoub Himi, Ilaria Barone, Giorgio Cassiani, Albert Casas Ponsati

Remote. Sens., 2022

2021

Time domain electromagnetic response of a conductive and magnetic permeable sphere via exponential sums.

Gian Piero Deidda, Patricia Diaz de Alba, Luisa Fermo, Giuseppe Rodriguez

Proceedings of the 2021 21st International Conference on Computational Science and Its Applications (ICCSA), Cagliari, Italy, September 13-16, 2021, 2021

2020

Remote Sensing, Archaeological, and Geophysical Data to Study the Terramare Settlements: The Case Study of Fondo Paviani (Northern Italy).

Rita Deiana, David Vicenzutto, Gian Piero Deidda, Jacopo Boaga, Michele Cupitò

Remote. Sens., 2020

FDEMtools: a MATLAB package for FDEM data inversion.

Gian Piero Deidda, Patricia Diaz de Alba, Caterina Fenu, G. Lovicu, Giuseppe Rodriguez

Numer. Algorithms, 2020

2018

Smooth and Sparse Inversion of EMI Data from Multi-Configuration Measurements.

Gian Piero Deidda, Patricia Diaz de Alba, Giulio Vignoli

Proceedings of the 4th IEEE International Forum on Research and Technology for Society and Industry, 2018