Gyung-Su Byun

Orcid: 0000-0002-6505-8663

According to our database1, Gyung-Su Byun authored at least 20 papers between 2014 and 2025.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2025
Automated Internal Defect Identification and Localization Based on a Near-Field SAR Millimeter-Wave Imaging System.
IEEE Access, 2025

2024
A High-Speed HBM Receiver Design for High-Performance Computing Systems.
Proceedings of the 21st International SoC Design Conference, 2024

Analysis and Design of CRC-based SENT Interface for Future Automotive Applications.
Proceedings of the 21st International SoC Design Conference, 2024

2021
The Comparison Features of ECG Signal with Different Sampling Frequencies and Filter Methods for Real-Time Measurement.
Symmetry, 2021

A High-speed Wireless Data Transfer for Non - Destructive Testing.
Proceedings of the 18th International SoC Design Conference, 2021

2018
Three-Dimensional Pipeline ADC Utilizing TSV/ Design Optimization and Memristor Ratioed Logic.
IEEE Trans. Very Large Scale Integr. Syst., 2018

A Wide-Range Low-Power PLL-Based PI Multiphase Generator Using an Adaptive Frequency Tracking Technique.
IEEE Trans. Circuits Syst. II Express Briefs, 2018

Design of a Pre-Distortion Power Amplifier for Ku-Band/5G Applications.
Proceedings of the 2018 IEEE International Conference on Electro/Information Technology, 2018

A 3D flash ADC structure for high-speed communication applications.
Proceedings of the IEEE 8th Annual Computing and Communication Workshop and Conference, 2018

2017
An Energy-Efficient Mobile Memory I/O Interface Using Simultaneous Bidirectional Multilevel Dual-Band Signaling.
IEEE Trans. Circuits Syst. II Express Briefs, 2017

Automatic Design and Yield Enhancement of Data Converters.
J. Circuits Syst. Comput., 2017

Yield-aware sizing of pipeline ADC using a multiple-objective evolutionary algorithm.
Int. J. Circuit Theory Appl., 2017

A performance-aware I/O interface for 3D stacked memory systems.
Proceedings of the 8th IEEE Annual Ubiquitous Computing, 2017

Low-power and high-performance 2.4 GHz RF transmitter for biomedical application.
Proceedings of the 8th IEEE Annual Ubiquitous Computing, 2017

A low-power and performance-efficient SAR ADC design.
Proceedings of the International SoC Design Conference, 2017

High-performance RF-interconnect for 3D stacked memory.
Proceedings of the International SoC Design Conference, 2017

2016
A 14.4Gb/s/pin 230fJ/b/pin/mm multi-level RF-interconnect for global network-on-chip communication.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2016

2015
A Low-Power 4-PAM Transceiver Using a Dual-Sampling Technique for Heterogeneous Latency-Sensitive Network-on-Chip.
IEEE Trans. Circuits Syst. II Express Briefs, 2015

2014
Comparative analysis of clock distribution networks for TSV-based 3D IC designs.
Proceedings of the Fifteenth International Symposium on Quality Electronic Design, 2014

An energy-efficient mobile PAM memory interface for future 3D stacked mobile DRAMs.
Proceedings of the Fifteenth International Symposium on Quality Electronic Design, 2014


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