Hak Sung Kim

Orcid: 0000-0002-6076-6636

According to our database1, Hak Sung Kim authored at least 1 paper in 2007.

Collaborative distances:
  • no known Dijkstra number2.
  • no known Erdős number3.

Timeline

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Links

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Bibliography

2007
Investigation of moisture-induced failures of stacked-die package.
Microelectron. Reliab., 2007


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