Hanju Oh

According to our database1, Hanju Oh authored at least 2 papers between 2013 and 2015.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

On csauthors.net:

Bibliography

2015
Silicon interposer platform with low-loss through-silicon vias using air.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013
Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013


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