Huafeng Liu
Orcid: 0000-0003-0757-2362Affiliations:
- Huazhong University of Science and Technology, School of Physics, MOE Key Laboratory of Fundamental Physical Quantities Measurement, Wuhan, China
- Imperial College London, UK (PhD 2016)
- University of Southampton, Southampton, UK (former)
According to our database1,
Huafeng Liu
authored at least 16 papers
between 2017 and 2025.
Collaborative distances:
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Bibliography
2025
Research on Compensation Approach for Motion Error of Rotating Accelerometer Gravity Gradiometer.
IEEE Trans. Instrum. Meas., 2025
A Novel Digital Lock-In Amplifier With Extended Lyapunov Demodulation for Wide Dynamic Range Applications.
IEEE Trans. Instrum. Meas., 2025
Postprocessing Compensation for Rotating Accelerometer Gravity Gradiometer Using Linear Motion Error Model Coefficient Calibration Method.
IEEE Trans. Instrum. Meas., 2025
2024
A Nano-g MOEMS Accelerometer Featuring Electromagnetic Force Balance With 157-dB Dynamic Range.
IEEE Trans. Ind. Electron., June, 2024
Noise Analysis and In Situ Detection of the Electromagnetic Servo Actuator for a Nano-g Accelerometer With a Large Dynamic Range.
IEEE Trans. Instrum. Meas., 2024
Tilt-Induced Noise Improvement of a Nano-g MEMS Accelerometer for Lunar Seismograph With Omnidirectional Deployment.
IEEE Trans. Instrum. Meas., 2024
Multiaccelerometer-Based Method for High-Precision Angular Acceleration Measurement of Turntable.
IEEE Trans. Instrum. Meas., 2024
2023
Proceedings of the 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2023
2021
Cross-Coupling Coefficient Estimation of a Nano-g Accelerometer by Continuous Rotation Modulation on a Tilted Rate Table.
IEEE Trans. Instrum. Meas., 2021
2020
An Integrated Gold-Film Temperature Sensor for In Situ Temperature Measurement of a High-Precision MEMS Accelerometer.
Sensors, 2020
Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer.
Sensors, 2020
A High-sensitivity Optical MEMS Accelerometer based on SOI Double-side Micromachining.
Proceedings of the 2020 IEEE Sensors, Rotterdam, The Netherlands, October 25-28, 2020, 2020
2019
A Universal High-Sensitivity Area-Variation Capacitive Displacement Transducer (CDT) Based on Fringe Effect.
IEEE Access, 2019
2018
Sensors, 2018
2017
High-Sensitivity Encoder-Like Micro Area-Changed Capacitive Transducer for a Nano-g Micro Accelerometer.
Sensors, 2017