Huai-Hui Ren

According to our database, Huai-Hui Ren authored at least 4 papers between 2011 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure.

Zhi-Hao Zhang, Xi-Shu Wang, Huai-Hui Ren, Su Jia, Hui-Hua Yang

Microelectron. Reliab., 2017

2014

Effects of solder balls and arrays on the failure behavior in Package-on-Package structure.

Xi-Shu Wang, Su Jia, Huai-Hui Ren, Pan Pan

Microelectron. Reliab., 2014

2013

Fracture analysis on die attach adhesives for stacked packages based on in-situ testing and cohesive zone model.

Huai-Hui Ren, Xi-Shu Wang, Su Jia

Microelectron. Reliab., 2013

2011

SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging.

Xi-Shu Wang, Xu-Dong Li, Huai-Hui Ren, Hai-Yan Zhao, Ryosuke Murai

Microelectron. Reliab., 2011