J. Moore

This page is a disambiguation page, it actually contains mutiple papers from persons of the same or a similar name.

Bibliography

2009
A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing.
Proceedings of the IEEE International Conference on 3D System Integration, 2009

2002
In memoriam: Edsger W. Dijkstra 1930-2002.
Commun. ACM, 2002

1995
Panel Languages and Models for Reusable Components.
Proceedings of the ACM SIGSOFT Symposium on Software Reusability, 1995

1986
Operating System Support on a RISC.
Proceedings of the Spring COMPCON'86, 1986

1981
Experience in writing VCG systems.
ACM SIGSOFT Softw. Eng. Notes, 1981

1977
The efficiency of certain production system implementations.
SIGART Newsl., 1977


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