Jang-Kwon Lim
Orcid: 0000-0002-9850-9440
According to our database1,
Jang-Kwon Lim authored at least 2 papers
between 2021 and 2026.
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Bibliography
2026
Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection.
IEEE Access, 2026
2021
Comparison of Thermal Stress During Short-Circuit in Different Types of 1.2-kV SiC Transistors Based on Experiments and Simulations.
IEEE Trans. Ind. Electron., 2021