Jean-Claude Lecomte

According to our database1, Jean-Claude Lecomte authored at least 2 papers between 2005 and 2009.

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Bibliography

2009
An advanced quality and reliability assessment approach applied to thermal stress issues in electronic components and assemblies.
Microelectron. Reliab., 2009

2005
New experimental approach for failure prediction in electronics: Topography and deformation measurement complemented with acoustic microscopy.
Microelectron. Reliab., 2005


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