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Jianxin Wang

Orcid: 0000-0002-4166-8520

Affiliations:
  • Osaka University, Joining and Welding Research Institute, Japan


According to our database1, Jianxin Wang authored at least 1 paper in 2014.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Bibliography

2014
Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging.
[BibTeX]
[DOI]
Jianxin Wang
,
Hiroshi Nishikawa
Microelectron. Reliab., 2014


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