Jie Zhang
Orcid: 0000-0002-6547-1570Affiliations:
- University of Electronic Science and Technology of China, School of Automation Engineering, Chengdu, China
According to our database1,
Jie Zhang
authored at least 8 papers
between 2021 and 2024.
Collaborative distances:
Collaborative distances:
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on orcid.org
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Bibliography
2024
Induced Current Thermo-Electrical Impedance Tomography for Nonferromagnetic Metal Material Surface Defect Profile Reconstruction.
IEEE Trans. Ind. Informatics, February, 2024
2023
Image Registration for Visualizing Magnetic Flux Leakage Testing under Different Orientations of Magnetization.
Entropy, January, 2023
2022
IEEE Access, 2022
Investigation of Thermal Deformation Characteristics in IGBT Modules Under Bonding Wire Cracking Condition.
Proceedings of the IECON 2022, 2022
2021
Moran's Index-Based Tensor Decomposition for Eddy Current Pulsed Thermography Sequence Processing.
IEEE Trans. Instrum. Meas., 2021
GAN-based Method with Small Training Samples for Defect Detection Using Magneto-optical Image.
Proceedings of the CAA Symposium on Fault Detection, 2021
A Thermal-Mechanical Deformation Based Fault Diagnosis Method Utilizing Support Vector Machine Algorithm for IGBT Bonding Wire Crack Detection.
Proceedings of the CAA Symposium on Fault Detection, 2021
An Infrared Thermal Image Defect Detection Method Based on Phase Features<sup>*</sup>.
Proceedings of the CAA Symposium on Fault Detection, 2021