Jing Feng Gong

According to our database, Jing Feng Gong authored at least 1 paper in 2004.

Collaborative distances:

• no known Dijkstra number.
• no known Erdős number.

2004

Al surface morphology effect on flip-chip solder bump shear strength.

Esther Wai Ching Yau, Jing Feng Gong, Philip Chan

Microelectron. Reliab., 2004