Jun Zhang

Orcid: 0000-0001-5976-3377

Affiliations:

Hohai University, Nanjing, China

According to our database¹, Jun Zhang authored at least 5 papers between 2016 and 2026.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

Timeline

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Bibliography

2026

Health Monitoring of Inductor Based on the Thermal Time Constant.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Electron., July, 2026

2019

Thermal Parameter Monitoring of IGBT Module Using Junction Temperature Cooling Curves.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Electron., 2019

Monitoring of the Cooling System via Thermal Parameters.

[BibT_eX]

[DOI]

IEEE Access, 2019

2017

Thermal network parameters identifying during the cooling procedure of IGBT module.

[BibT_eX]

[DOI]

Proceedings of the IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society, Beijing, China, October 29, 2017

2016

Lifetime estimation for IGBT modules in wind turbine power converter system considering ambient temperature.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2016

Jun Zhang

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Bibliography

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