Kangan Wang

According to our database, Kangan Wang authored at least 8 papers between 2017 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Topology and Operation Analysis of Hybrid DC/DC Converters with Bidirectional Asymmetric Power Flow.

Kangan Wang, Jianglin Xu, Siyu Wu, Derui Kong, Yixian Qu, Weimin Wu

Proceedings of the 49th Annual Conference of the IEEE Industrial Electronics Society, 2023

Hybrid DC Solid-State Transformer with Bidirectional Asymmetric Power Flow for Low-Penetration Renewable Energy Systems.

Kangan Wang, Junchen Wu, Siyu Wu, Yixian Qu, Derui Kong, Weimin Wu

Proceedings of the 49th Annual Conference of the IEEE Industrial Electronics Society, 2023

Analysis and Suppression of Circulating Current in DC/DC Converters with Bidirectional Asymmetric Power Flow.

Kangan Wang, Xiaoyang Fu, Chen Yang, Siyu Wu, Yixian Qu, Weimin Wu

Proceedings of the 49th Annual Conference of the IEEE Industrial Electronics Society, 2023

2022

Topology and Operation Analysis of Isolated DC/DC Converters with Bidirectional Asymmetric Power Flow.

Siyu Wu, Kangan Wang, Yixian Qu, Rongwu Zhu, Wei Tan, Weimin Wu, Marco Liserre

Proceedings of the IECON 2022, 2022

2019

Cascaded Multilevel Converter Topology for Large-Scale Photovoltaic System With Balanced Operation.

Kangan Wang, Rongwu Zhu, Chen Wei, Feng Liu, Xiaojie Wu, Marco Liserre

IEEE Trans. Ind. Electron., 2019

High-Efficiency Solid State Transformer Architecture for Large-scale PV Application.

Kangan Wang, Rongwu Zhu, Youngjong Ko, Marco Liserre

Proceedings of the IECON 2019, 2019

2018

Phase Power Balancing of Interphase Grid-Connected CHB-QAB PV Systems.

Kangan Wang, Markus Andresen, Sante Pugliese, Marco Liserre

Proceedings of the IECON 2018, 2018

2017

Cascaded H-bridge multilevel converter topology for large-scale photovoltaic system with balanced operation.

Kangan Wang, Xiaojie Wu, Feng Liu, Yingjie Wang, Rongwu Zhu

Proceedings of the IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society, Beijing, China, October 29, 2017