Linhong Lu

According to our database, Linhong Lu authored at least 3 papers in 2024.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2024

Novel accurate steady-state thermal resistance model for power chips embedded in TTSVs heat dissipation array.

Linhong Lu, Xinghua Fu, Rui Hu, Fashun Yang, Jiexin Lin, Zhongchen Bai, Kui Ma

Microelectron. J., 2024

Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias.

Rui Hu, Linhong Lu, Zhongchen Bai, Fashun Yang, Kui Ma, Zhao Ding

IEICE Electron. Express, 2024

Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips.

Rui Hu, Mengru Huang, Linhong Lu, Fashun Yang, Jiexin Lin, Kui Ma, Zhao Ding

IEICE Electron. Express, 2024